Compatible with both 8-inch and 12-inch wafers in the same equipment.

Suitable for highly warped wafers up to ±5 mm.

Oxygen content control: ≤20 ppm or ≤100 ppm.

Capable of processing up to 52 wafers simultaneously.

Supports both 13-layer and 25-layer FOUPs with automatic UI switching.

Equipped with software featuring repeated loading function; a single chamber can load and log data for more than 12 cassettes.

Convex door design for pressure oven: excellent thermal insulation, lightweight, high pressure resistance, and secured with door interlock for safety.

Each chamber is certified by the Pressure Vessel Association with an independent qualification certificate.

Circulation motor with built-in heat dissipation design, requiring no additional water cooling.

Chamber overpressure protection: three-stage independent pressure control and exhaust, automatic pressure switch protection, and mechanical safety valve protection.

Temperature range: RT ~ 200℃.

Two chambers can be set with different process conditions and operate simultaneously.

Centralized uploading of recipes and functional parameters, complying with semiconductor SECS/GEM and EAP requirements.

Optional vacuum system to enhance large bubble removal capability.

Optional AGV/OHT system integration.

Optional third-party certifications including ASME, SEMI S2 & S8, or CE.